Name: 19th IC & Sensor Packaging Technology Expo
Start: 2018-01-17T00:00:00
End: 2018-01-19T00:00:00
Location: Tokyo Big Sight,Japan

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Must read

Packaging Insights reviews 2024: UN Global Plastic Treaty, EU’s revised waste rules and industry mega-mergers

Geopolitics and packaging: Impact of tariffs on the global industry

US Plastics Pact report calls on businesses to tackle low recycling rates

Must read

Packaging Insights reviews 2024: UN Global Plastic Treaty, EU’s revised waste rules and industry mega-mergers

Geopolitics and packaging: Impact of tariffs on the global industry

US Plastics Pact report calls on businesses to tackle low recycling rates

Must read

Packaging Insights reviews 2024: UN Global Plastic Treaty, EU’s revised waste rules and industry mega-mergers

Geopolitics and packaging: Impact of tariffs on the global industry

US Plastics Pact report calls on businesses to tackle low recycling rates

Must read

Packaging Insights reviews 2024: UN Global Plastic Treaty, EU’s revised waste rules and industry mega-mergers

Geopolitics and packaging: Impact of tariffs on the global industry

US Plastics Pact report calls on businesses to tackle low recycling rates

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The world of food ingredients

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Must read

Packaging Insights reviews 2024: UN Global Plastic Treaty, EU’s revised waste rules and industry mega-mergers

Geopolitics and packaging: Impact of tariffs on the global industry

US Plastics Pact report calls on businesses to tackle low recycling rates

Must read

Packaging Insights reviews 2024: UN Global Plastic Treaty, EU’s revised waste rules and industry mega-mergers

Geopolitics and packaging: Impact of tariffs on the global industry

US Plastics Pact report calls on businesses to tackle low recycling rates

Suppliers

Supplier profiles

Must read

Packaging Insights reviews 2024: UN Global Plastic Treaty, EU’s revised waste rules and industry mega-mergers

Geopolitics and packaging: Impact of tariffs on the global industry

US Plastics Pact report calls on businesses to tackle low recycling rates

Home Events19th IC & Sensor Packaging Technology Expo

19th IC & Sensor Packaging Technology Expo

Date

17 Jan 2018 - 19 Jan 2018

Location

Tokyo Big Sight,Japan

Organizer

Reed Exhibitions Japan Ltd

isp@reedexpo.co.jp

Website

http://www.reedexpo.co.jp

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