09 Feb 2024 --- Sarcina Technology, a US-based Application Specific Advanced Packaging (ASAP) service company, rolled out its WIPO service at the Chiplet Summit in Santa Clara, US, February 6–8. WIPO stands for wafer-in and product-out, and eliminates the exorbitant costs of maintaining a hardware team for packaging, testing and production. “Last year was the first Chiplet Summit conference. The topic was hot then. The conference attracted a huge number of participants. But major IP companies, Electronic Design Automation companies and Application-specific integrated circuit service companies did not show up. This year, most of them showed up and had a booth to demonstrate their latest technologies and capabilities,” Larry Zu, CEO at Sarcina Technology, tells Packaging Insights.
