18 Apr 2024 --- E-paper technology company E Ink is replacing paper labels with e-paper shelf labels for increased retailer efficiency and lower carbon emissions. To achieve this goal, E Ink is collaborating with ecosystem partners Realtek Semiconductor (Realtek), Integrated Solutions Technology (IST) and Chipbond Technology Corporation (Chipbond) to develop the System on Panel (SoP) architecture. The technology will be integrated into the next-generation electronic shelf label (ESL), which will be jointly developed with the system integrator, Solum. The collaboration aims to deliver sustainability via reduced material usage, lower power consumption and simplified production processes to simplify the material structure of ESL.
