14 Aug 2023 --- Two key metrics, bandwidth and power efficiency, are crucial to determine the success of advanced semiconductor packaging solutions, finds technology company IDTechEx. The company discusses material requirements for achieving higher bandwidth, one of the essential factors for improved communication between dies. With high demand for improved performance and efficiency in electronic devices, the semiconductor industry is pushing the boundaries of packaging technology. In the context of interconnected dies on a package, the system’s performance relies on the signaling within the package. Bandwidth is a critical performance metric in advanced semiconductor packaging. It refers to the amount of data transmitted or communicated between the dies on the package. Higher bandwidth allows faster and more efficient communication, enabling devices to process data at high speeds, explains the technology company.
