29 Jun 2023 --- To address the rapid growth in the chiplet market for mobile and high-performance computing (HPC) applications, Samsung Electronics is launching the Multi-Die Integration (MDI) Alliance in collaboration with its partner companies and “major players” in memory, substrate packaging and testing. The advanced semiconductor technology provider announced its latest foundry technology innovations and business strategy at the 7th annual Samsung Foundry Forum (SFF) 2023 in San Jose, US and is addressing customer needs in the AI sphere through advanced semiconductor technology. As part of its business strategy to solidify its competitiveness as a leading foundry service, Samsung Foundry expanded applications of its 2-nanometer process and specialty process. It also expanded production capacity at its Pyeongtaek fab Line 3.
